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Intel Integrated Circuits286Full die shot of the Intel 286 microprocessor showing the complete pad and bonding points using oblique illumination with red and blue gels. BACK TO INTEL INTEGRATED CIRCUITS Questions or comments? Send us an email.© 1995-2022 by Michael W. Davidson and The Florida State University. All Rights Reserved. No images, graphics, software, scripts, or applets may be reproduced or used in any manner without permission from the copyright holders. Use of this website means you agree to all of the Legal Terms and Conditions set forth by the owners.
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