IBM/Motorola Integrated Circuits
PowerPC 603
Partial die shot of the IBM/Motorola PowerPC 603 microprocessor showing the die pad, bonding points, and bus connections using oblique illumination with red and green gels.
BACK TO MOTOROLA INTEGRATED CIRCUITS
Questions or comments? Send us an email.
© 1995-2022 by Michael W. Davidson and The Florida State University. All Rights Reserved. No images, graphics, software, scripts, or applets may be reproduced or used in any manner without permission from the copyright holders. Use of this website means you agree to all of the Legal Terms and Conditions set forth by the owners.
This website is maintained by our
Graphics & Web Programming Team
in collaboration with Optical Microscopy at the
National High Magnetic Field Laboratory.
Last modification: Friday, Nov 13, 2015 at 01:18 PM
Access Count Since April 1, 1999: 17239
Microscopes provided exclusively by:
