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QX3 Digital Image Gallery

Bonding Wires

Oblique reflected light illumination with a series of colored gels can be used effectively to create artistic digital images of the tiny bonding wires on integrated circuits. These wires are attached directly to pads on the chips and serve as electrical contacts for current flow into and out of the chips.

Bonding Wires at 200x Magnification

Bonding Wires at 200x Magnification

Bonding Wires at 200x Magnification

The digital images presented above were captured using the oblique illuminator built into the microscope head with the assistance of a Dolan-Jenner Model 180 fiber optics illuminator using a 150 watt projection lamp. The light pipes of the illuminator were placed at approximately a 45-degree angle with respect to the optical axis of the microscope and were positioned to evenly illuminate the specimen. In many cases, colored gels were placed into filter holders and attached to the front of the light pipes to add color to the chip surfaces. A 2-inch square section of black paper was placed over the diffusion filter on the stage of the microscope to avoid any glare from transmitted illumination.

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