Three chip giants, IBM, Siemens, and Toshiba collaborate on a number of projects including the fabrication of memory integrated circuits. The collaborative logo illustrated above was photographed on a 64 Mbit DRAM chip marketed by Toshiba. Notice the jagged edge of the die, on the left-hand side of the photomicrograph, where the individual chip was cut from a wafer containing many identical dies.

The chip containing this artwork was loaned to us by Chipworks, a company that is an international provider of reverse engineering services, analyzing the circuitry and physical composition of semiconductor chips and electronics systems for competitive study, intellectual property support, and reliability assurance.