Cyrix Integrated Circuits
6x86 Microprocessor Die Polysilicon Layer
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The digital image featured above reveals surface detail present on a Cyrix 6x86 microprocessor die at the polysilicon stage in the fabrication process. Captured in reflected light illumination mode, the microscope utilized to produce the image was also equipped with differential interference contrast (DIC) optics to enhance minute features on the surface. Busses, data and instructional caches, and registers were highlighted with oblique illumination using red, green, blue, and yellow gels. |
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