Cyrix Integrated Circuits

6x86 Microprocessor Die Polysilicon Layer

6x86 Microprocessor Die Polysilicon Layer

The digital image featured above reveals surface detail present on a Cyrix 6x86 microprocessor die, showing the complete pad ring, at the polysilicon stage in the fabrication process. The microscope utilized to produce the image was operating in reflected light illumination mode and was also equipped with differential interference contrast (DIC) optics to enhance minute features on the surface. Busses, data and instructional caches, and registers were highlighted with oblique illumination using red, green, blue, and yellow gels.


© 1995-2022 by Michael W. Davidson and The Florida State University. All Rights Reserved. No images, graphics, software, scripts, or applets may be reproduced or used in any manner without permission from the copyright holders. Use of this website means you agree to all of the Legal Terms and Conditions set forth by the owners.
This website is maintained by our
Graphics & Web Programming Team
in collaboration with Optical Microscopy at the
National High Magnetic Field Laboratory.
Last modification: Monday, Nov 28, 2005 at 11:43 AM
Access Count Since November 1, 1996: 32107
Microscopes provided exclusively by: