Cyrix Integrated Circuits

6x86 Microprocessor Die Polysilicon Layer

6x86 Microprocessor Die Polysilicon Layer

The digital image featured above reveals surface detail present on a Cyrix 6x86 microprocessor die, showing the complete pad ring, at the polysilicon stage in the fabrication process. The microscope utilized to produce the image was operating in reflected light illumination mode and was also equipped with differential interference contrast (DIC) optics to enhance minute features on the surface. Busses, data and instructional caches, and registers were highlighted with oblique illumination using red, green, blue, and yellow gels.


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